Stress analysis of the adhesive resin layer in a reinforced pin-loaded joint used in glass structures

Quy-Dong To (1) , Qi-Chang He (1) , Michel Cossavella (2) , Karine Morcant (2) , Adrian Panait (2)

1 MSME - Laboratoire Modélisation et Simulation Multi-Echelle
2 CSTB - Centre Scientifique et Technique du Bâtiment

A reinforced pin-loaded joint used to assemble elements in a tempered glass structure consists of a steel bolt and a steel ring glued to a glass plate through an adhesive resin layer. The stiffness of a typical resin material is generally much lower than the stiffness of steel or glass. This fact leads us to make the assumption that the stress field in the adhesive resin layer is essentially due to the relative rigid displacements of the steel ring with respect to the glass plate. On the basis of this assumption, an analytical solution is obtained for the stresses in the adhesive resin layer. This solution is compared with and validated by the numerical results obtained by the finite element method.

Domaines: Mécanique [physics.med-ph]

Quy-Dong To, Qi-Chang He, Michel Cossavella, Karine Morcant, Adrian Panait. Stress analysis of the adhesive resin layer in a reinforced pin-loaded joint used in glass structures. International Journal of Adhesion and Adhesives, 2009, 29 (1), pp.91-97. ⟨10.1016/j.ijadhadh.2008.01.008⟩. ⟨hal-00733151⟩